Assignee
IM YUN-HYEOK
KR·2 granted patents·1 pending application·19 citations·filing 2005–2012
Top patents by PatentIndex Score
3 records- 0189US8643179B2Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor packageIM YUN-HYEOK·Filed 2011·Granted Feb 4, 2014·11 cites·22 claims
- 0284US8587134B2Semiconductor packagesIM YUN-HYEOK·Filed 2012·Granted Nov 19, 2013·8 cites·20 claims
- 0338US2006075760A1Temperature measuring device using a matrix switch, a semiconductor package and a cooling systemIM YUN-HYEOK·Filed 2005·Application pending·0 cites
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