Assignee
IM YUNHYEOK
KR·4 granted patents·2 pending applications·30 citations·filing 2011–2016
Top patents by PatentIndex Score
6 records- 0191US9978661B2Packaged semiconductor chips having heat dissipation layers and ground contacts thereinIM YUNHYEOK·Filed 2016·Granted May 22, 2018·12 cites·6 claims
- 0285US9024434B2Semiconductor packagesIM YUNHYEOK·Filed 2012·Granted May 5, 2015·8 cites·16 claims
- 0381US9356002B2Semiconductor package and method for manufacturing the sameIM YUNHYEOK·Filed 2015·Granted May 31, 2016·4 cites·20 claims
- 0480US9013031B2Semiconductor packages including heat diffusion vias and interconnection viasIM YUNHYEOK·Filed 2014·Granted Apr 21, 2015·6 cites·20 claims
- 0539US2012175782A1Semiconductor package and method of manufacturing the sameIM YUNHYEOK·Filed 2012·Application pending·0 cites
- 0638US2012119346A1Semiconductor package and method of forming the sameIM YUNHYEOK·Filed 2011·Application pending·0 cites
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