Assignee

IMAMURA HISAYUKI

JP·1 granted patent·3 citations·filing 2012–2012

Technology mixB22F1 B23K1 C04B1 C22C1 H01L1 H05K1

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0166US9780011B2Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor moduleIMAMURA HISAYUKI·Filed 2012·Granted Oct 3, 2017·3 cites·16 claims

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