Assignee
INAO YOSHIHIRO
JP·4 granted patents·11 citations·filing 2007–2011
Top patents by PatentIndex Score
4 records- 0178US9048311B2Laminate and method for separating the sameINAO YOSHIHIRO·Filed 2011·Granted Jun 2, 2015·4 cites·5 claims
- 0276US8080121B2Method of bonding, thinning, and releasing waferINAO YOSHIHIRO·Filed 2007·Granted Dec 20, 2011·5 cites·4 claims
- 0368US9492986B2Laminate and method for separating the sameINAO YOSHIHIRO·Filed 2011·Granted Nov 15, 2016·2 cites·7 claims
- 0448US8297331B2Separating apparatus and separating methodINAO YOSHIHIRO·Filed 2009·Granted Oct 30, 2012·0 cites·8 claims
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