Assignee
INCEP TECHNOLOGIES INC
US·14 granted patents·2 pending applications·838 citations·filing 1999–2003
Top patents by PatentIndex Score
16 records- 0197US6304450B1Inter-circuit encapsulated packagingINCEP TECHNOLOGIES INC·Filed 1999·Granted Oct 16, 2001·244 cites·14 claims
- 0293US6452113B2Apparatus for providing power to a microprocessor with integrated thermal and EMI managementINCEP TECHNOLOGIES INC·Filed 2001·Granted Sep 17, 2002·88 cites·51 claims
- 0390US6490160B2Vapor chamber with integrated pin arrayINCEP TECHNOLOGIES INC·Filed 2001·Granted Dec 3, 2002·90 cites·20 claims
- 0489US6452804B1Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plateINCEP TECHNOLOGIES INC·Filed 2001·Granted Sep 17, 2002·45 cites·20 claims
- 0588US6618268B2Apparatus for delivering power to high performance electronic assembliesINCEP TECHNOLOGIES INC·Filed 2001·Granted Sep 9, 2003·80 cites·14 claims
- 0687US6847529B2Ultra-low impedance power interconnection system for electronic packagesINCEP TECHNOLOGIES INC·Filed 2001·Granted Jan 25, 2005·42 cites·37 claims
- 0785US6556455B2Ultra-low impedance power interconnection system for electronic packagesINCEP TECHNOLOGIES INC·Filed 2001·Granted Apr 29, 2003·47 cites·27 claims
- 0884US6623279B2Separable power delivery connectorINCEP TECHNOLOGIES INC·Filed 2002·Granted Sep 23, 2003·42 cites·63 claims
- 0982US6698511B2Vortex heatsink for high performance thermal applicationsINCEP TECHNOLOGIES INC·Filed 2002·Granted Mar 2, 2004·41 cites·14 claims
- 1081US6801431B2Integrated power delivery and cooling system for high power microprocessorsINCEP TECHNOLOGIES INC·Filed 2002·Granted Oct 5, 2004·36 cites·10 claims
- 1176US6845013B2Right-angle power interconnect electronic packaging assemblyINCEP TECHNOLOGIES INC·Filed 2003·Granted Jan 18, 2005·27 cites·13 claims
- 1276US6741480B2Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systemsINCEP TECHNOLOGIES INC·Filed 2001·Granted May 25, 2004·23 cites·17 claims
- 1372US6609914B2High speed and density circular connector for board-to-board interconnection systemsINCEP TECHNOLOGIES INC·Filed 2001·Granted Aug 26, 2003·18 cites·34 claims
- 1465US6754086B2Integrated magnetic buck converter with magnetically coupled synchronously rectified mosfet gate driveINCEP TECHNOLOGIES INC·Filed 2002·Granted Jun 22, 2004·15 cites·12 claims
- 1538US2001038527A1Inter-circuit encapsulated packagingINCEP TECHNOLOGIES INC·Filed 2001·Application pending·0 cites
- 1637US2002151195A1Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrateINCEP TECHNOLOGIES INC·Filed 2002·Application pending·0 cites
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