Assignee
INDIUM CORP
US·35 granted patents·17 pending applications·109 citations·filing 1986–2025
Top patents by PatentIndex Score
52 records- 0195US8348139B2Composite solder alloy preformINDIUM CORP·Filed 2010·Granted Jan 8, 2013·25 cites·13 claims
- 0288US11267080B2Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powdersINDIUM CORP·Filed 2019·Granted Mar 8, 2022·5 cites·19 claims
- 0386US12300567B2Solid metal foam thermal interface materialINDIUM CORP·Filed 2022·Granted May 13, 2025·1 cites·16 claims
- 0485US12451402B2Liquid metal thermal interfaceINDIUM CORP·Filed 2022·Granted Oct 21, 2025·1 cites·15 claims
- 0585US10943796B2Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchangerINDIUM CORP·Filed 2019·Granted Mar 9, 2021·4 cites·16 claims
- 0684US11752579B2High reliability leadfree solder alloys for harsh service conditionsINDIUM CORP·Filed 2020·Granted Sep 12, 2023·1 cites·20 claims
- 0784US9741676B1Tin-indium based low temperature solder alloyINDIUM CORP·Filed 2016·Granted Aug 22, 2017·3 cites·20 claims
- 0884US9468136B2Low void solder joint for multiple reflow applicationsINDIUM CORP·Filed 2014·Granted Oct 11, 2016·9 cites·37 claims
- 0984US2025001530A1High reliability lead-free solder alloys for harsh environment electronics applicationsINDIUM CORP·Filed 2024·Application pending·0 cites
- 1081US2026077436A1Solder preform with internal flux core including thermochromic indicatorINDIUM CORP·Filed 2025·Application pending·0 cites
- 1180US12240060B2SnIn solder alloysINDIUM CORP·Filed 2022·Granted Mar 4, 2025·0 cites·19 claims
- 1279US12090579B2High reliability lead-free solder alloys for harsh environment electronics applicationsINDIUM CORP·Filed 2022·Granted Sep 17, 2024·0 cites·12 claims
- 1378US11602808B2Solder preform with internal flux core including thermochromic indicatorINDIUM CORP·Filed 2020·Granted Mar 14, 2023·2 cites·14 claims
- 1478US9636784B2Mixed alloy solder pasteINDIUM CORP·Filed 2015·Granted May 2, 2017·3 cites·34 claims
- 1577US10943795B2Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchangerINDIUM CORP·Filed 2019·Granted Mar 9, 2021·2 cites·8 claims
- 1677US10607857B2Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchangerINDIUM CORP·Filed 2017·Granted Mar 31, 2020·2 cites·10 claims
- 1777US2023405677A1Thermally decomposing build plate for facile release of 3d printed objectsINDIUM CORP·Filed 2023·Application pending·0 cites
- 1876US11738411B2Lead-free solder paste with mixed solder powders for high temperature applicationsINDIUM CORP·Filed 2021·Granted Aug 29, 2023·1 cites·18 claims
- 1972US12521821B2Solder preform with internal flux core including thermochromic indicatorINDIUM CORP·Filed 2023·Granted Jan 13, 2026·0 cites·14 claims
- 2072US11999018B2SnBi and SnIn solder alloysINDIUM CORP·Filed 2019·Granted Jun 4, 2024·0 cites·12 claims
- 2171US11229979B2High reliability lead-free solder alloys for harsh environment electronics applicationsINDIUM CORP·Filed 2016·Granted Jan 25, 2022·1 cites·12 claims
- 2271US10888958B2Hybrid high temperature lead-free solder preformINDIUM CORP·Filed 2018·Granted Jan 12, 2021·2 cites·19 claims
- 2370US12023735B2Thermally decomposable build plate structure for stabilization of metal build surface during 3D printing and facile release of 3D printed objectsINDIUM CORP·Filed 2023·Granted Jul 2, 2024·0 cites·19 claims
- 2470US11712762B2Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powdersINDIUM CORP·Filed 2022·Granted Aug 1, 2023·0 cites·21 claims
- 2570US10328533B2Hybrid lead-free solder wireINDIUM CORP·Filed 2017·Granted Jun 25, 2019·0 cites·25 claims
- 2669US4746583ACeramic combined coverINDIUM CORP·Filed 1986·Granted May 24, 1988·46 cites·12 claims
- 2769US2024326133A1Thermally decomposable build plate structure for stabilization of metal build surface during 3d printing and facile release of 3d printed objectsINDIUM CORP·Filed 2024·Application pending·0 cites
- 2865US11413709B2High reliability lead-free solder alloys for harsh environment electronics applicationsINDIUM CORP·Filed 2019·Granted Aug 16, 2022·0 cites·5 claims
- 2964US10118260B2Mixed alloy solder pasteINDIUM CORP·Filed 2015·Granted Nov 6, 2018·1 cites·27 claims
- 3063US9802274B2Hybrid lead-free solder wireINDIUM CORP·Filed 2016·Granted Oct 31, 2017·0 cites·22 claims
- 3162US11766721B2Thermally decomposing build plate for facile release of 3D printed objectsINDIUM CORP·Filed 2020·Granted Sep 26, 2023·0 cites·10 claims
- 3254US2017373034A1Tin-indium based low temperature solder alloyINDIUM CORP·Filed 2017·Application pending·0 cites
- 3352US12042864B2Thermally decomposing build plate with casting mold for facile release of 3D printed objectsINDIUM CORP·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 3452US2021047710A1Ge-doped ausn solder alloysINDIUM CORP·Filed 2019·Application pending·0 cites
- 3549US2022266344A1Build plate with thermally decomposing top surface for facile release of 3d printed objectsINDIUM CORP·Filed 2022·Application pending·0 cites
- 3648US2022395936A1High reliability lead-free solder pastes with mixed solder alloy powdersINDIUM CORP·Filed 2022·Application pending·0 cites
- 3747US11807536B2Method for preparing graphite sheets with piercing treatment to enhance thermal conductionINDIUM CORP·Filed 2020·Granted Nov 7, 2023·0 cites·10 claims
- 3845US2019030653A1Solder ribbon with embedded mesh for improved reliability of semiconductor die to substrate attachmentINDIUM CORP·Filed 2018·Application pending·0 cites
- 3944US10756039B2Fluxes effective in suppressing non-wet-open at BGA assemblyINDIUM CORP·Filed 2018·Granted Aug 25, 2020·0 cites·13 claims
- 4044US2017203393A1Capillary blockINDIUM CORP·Filed 2017·Application pending·0 cites
- 4144US2023197558A1Liquid metal paste containing metal particle additiveINDIUM CORP·Filed 2022·Application pending·0 cites
- 4243US11581239B2Lead-free solder paste as thermal interface materialINDIUM CORP·Filed 2020·Granted Feb 14, 2023·0 cites·11 claims
- 4343US9875983B2Nanomicrocrystallite paste for pressureless sinteringINDIUM CORP·Filed 2016·Granted Jan 23, 2018·0 cites·20 claims
- 4442US2017203380A1Capillary blockINDIUM CORP·Filed 2016·Application pending·0 cites
- 4542US2018361518A1Solder ribbon with embedded mesh for improved reliability of semiconductor die to substrate attachmentINDIUM CORP·Filed 2017·Application pending·0 cites
- 4641US10838002B2Burn-in preform and method of making the sameINDIUM CORP·Filed 2018·Granted Nov 17, 2020·0 cites·20 claims
- 4741US10813228B2Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive materialINDIUM CORP·Filed 2019·Granted Oct 20, 2020·0 cites·19 claims
- 4836US2020230750A1Lead-free solder paste for thermal via fillingINDIUM CORP·Filed 2019·Application pending·0 cites
- 4936US2023142030A1Liquid metal composites containing organic additive as thermal interface materials, and methods of their useINDIUM CORP·Filed 2022·Application pending·0 cites
- 5034US2015258638A1Methods and compositions for forming solder bumps on a substrate with radiation curable or thermal curable solder fluxINDIUM CORP·Filed 2015·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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