Assignee
INDIUM CORP
US35 patents
Top patents by PatentIndex Score
US8348139B2Jan 8, 2013
Composite solder alloy preform
INDIUM CORP25 citations92
US4746583AMay 24, 1988
Ceramic combined cover
INDIUM CORP46 citations86
US11229979B2Jan 25, 2022
High reliability lead-free solder alloys for harsh environment electronics applications
INDIUM CORP1 citations73
US9636784B2May 2, 2017
Mixed alloy solder paste
INDIUM CORP3 citations72
US9468136B2Oct 11, 2016
Low void solder joint for multiple reflow applications
INDIUM CORP9 citations70
US11267080B2Mar 8, 2022
Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
INDIUM CORP5 citations69
US10888958B2Jan 12, 2021
Hybrid high temperature lead-free solder preform
INDIUM CORP2 citations68
US10943795B2Mar 9, 2021
Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger
INDIUM CORP2 citations67
US10943796B2Mar 9, 2021
Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger
INDIUM CORP4 citations67
US10607857B2Mar 31, 2020
Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger
INDIUM CORP2 citations67
US9741676B1Aug 22, 2017
Tin-indium based low temperature solder alloy
INDIUM CORP3 citations64
US11602808B2Mar 14, 2023
Solder preform with internal flux core including thermochromic indicator
INDIUM CORP2 citations63
US12090579B2Sep 17, 2024
High reliability lead-free solder alloys for harsh environment electronics applications
INDIUM CORP0 citations62
US11413709B2Aug 16, 2022
High reliability lead-free solder alloys for harsh environment electronics applications
INDIUM CORP0 citations62
US12451402B2Oct 21, 2025
Liquid metal thermal interface
INDIUM CORP1 citations60
US11752579B2Sep 12, 2023
High reliability leadfree solder alloys for harsh service conditions
INDIUM CORP1 citations60
US11712762B2Aug 1, 2023
Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
INDIUM CORP0 citations59
US12240060B2Mar 4, 2025
SnIn solder alloys
INDIUM CORP0 citations58
US11999018B2Jun 4, 2024
SnBi and SnIn solder alloys
INDIUM CORP0 citations58
US12300567B2May 13, 2025
Solid metal foam thermal interface material
INDIUM CORP1 citations57
US11807536B2Nov 7, 2023
Method for preparing graphite sheets with piercing treatment to enhance thermal conduction
INDIUM CORP0 citations56
US12521821B2Jan 13, 2026
Solder preform with internal flux core including thermochromic indicator
INDIUM CORP0 citations53
US11738411B2Aug 29, 2023
Lead-free solder paste with mixed solder powders for high temperature applications
INDIUM CORP1 citations53
US11581239B2Feb 14, 2023
Lead-free solder paste as thermal interface material
INDIUM CORP0 citations52
US10328533B2Jun 25, 2019
Hybrid lead-free solder wire
INDIUM CORP0 citations51
US10118260B2Nov 6, 2018
Mixed alloy solder paste
INDIUM CORP1 citations51
US9802274B2Oct 31, 2017
Hybrid lead-free solder wire
INDIUM CORP0 citations51
US12023735B2Jul 2, 2024
Thermally decomposable build plate structure for stabilization of metal build surface during 3D printing and facile release of 3D printed objects
INDIUM CORP0 citations48
US10838002B2Nov 17, 2020
Burn-in preform and method of making the same
INDIUM CORP0 citations48
US10756039B2Aug 25, 2020
Fluxes effective in suppressing non-wet-open at BGA assembly
INDIUM CORP0 citations48
US9875983B2Jan 23, 2018
Nanomicrocrystallite paste for pressureless sintering
INDIUM CORP0 citations47
US11766721B2Sep 26, 2023
Thermally decomposing build plate for facile release of 3D printed objects
INDIUM CORP0 citations42
US12042864B2Jul 23, 2024
Thermally decomposing build plate with casting mold for facile release of 3D printed objects
INDIUM CORP0 citations41
US10813228B2Oct 20, 2020
Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material
INDIUM CORP0 citations28
US10537030B2Jan 14, 2020
Voiding control using solid solder preforms embedded in solder paste
INDIUM CORP0 citations26