Assignee
INST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES
CN·5 granted patents·13 pending applications·1 citations·filing 2020–2025
Top patents by PatentIndex Score
18 records- 0176US11609672B1Touch control substrate and preparation method thereof, touch control module and display deviceINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2022·Granted Mar 21, 2023·1 cites·20 claims
- 0256US12506252B2Fan-out package structure and fabrication method thereforINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0356US2025157971A1Three-dimensional chip stack preparing method and three-dimensional chip stacking structureINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Application pending·0 cites
- 0456US2025192091A1Fan-out package structure and fan-out package methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Application pending·0 cites
- 0553US2024153913A13d stacked packaging structure and manufacturing method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Application pending·0 cites
- 0651US2024234328A9Multi-chip interconnection package structure with heat dissipation plate and preparation method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0751US2024304556A1Chiplet-fine-interconnection-package structure and method of manufacturing the sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0848US2024186254A1Carrier structure suitable for chiplet fine line and manufacturing method thereof, and fine line chiplet packaging structure and manufacturing method of the sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0948US2025246533A1Fan-out package structure with inter-chip fine internal interconnection line and manufacturing method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2022·Application pending·0 cites
- 1046US12184253B2Filter radio frequency module packaging structure and method for manufacturing sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Dec 31, 2024·0 cites·18 claims
- 1144US11869872B2Chip stack packaging structure and chip stack packaging methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Jan 9, 2024·0 cites·19 claims
- 1244US2023245944A1Fan-out type package preparation method of fan-out type packageINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Application pending·0 cites
- 1343US12112956B2Chip interconnection package structure and methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Oct 8, 2024·0 cites·20 claims
- 1443US2023402525A1Manufacturing method for n-polar gan transistor structure and semiconductor structureINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Application pending·0 cites
- 1543US2025336873A1Back-to-back three-dimensional stacked fan-out packaging structure and preparation method thereof, back-to-back three-dimensional stacked fan-out packaging module and preparation method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2025·Application pending·0 cites
- 1642US2022375892A1Chip packaging method and chip packaging structureINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Application pending·0 cites
- 1741US2025300059A1Double-sided stacked fan-out package device and fabrication method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2025·Application pending·0 cites
- 1840US2022149007A1Chip packaging structure and methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2020·Application pending·0 cites
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