Assignee
INVENSAS LLC
US16 patents
Top patents by PatentIndex Score
US11387202B2Jul 12, 2022
Nanowire bonding interconnect for fine-pitch microelectronics
INVENSAS LLC57 citations98
US11387214B2Jul 12, 2022
Multi-chip modules formed using wafer-level processing of a reconstituted wafer
INVENSAS LLC61 citations98
US11462483B2Oct 4, 2022
Wire bond wires for interference shielding
INVENSAS LLC3 citations83
US11929337B2Mar 12, 2024
3D-interconnect
INVENSAS LLC3 citations75
US12040284B2Jul 16, 2024
3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna
INVENSAS LLC2 citations73
US11605614B2Mar 14, 2023
Correction die for wafer/die stack
INVENSAS LLC1 citations73
US11495579B2Nov 8, 2022
Capacitive coupling in a direct-bonded interface for microelectronic devices
INVENSAS LLC1 citations73
US11369020B2Jun 21, 2022
Stacked transmission line
INVENSAS LLC2 citations73
US11810867B2Nov 7, 2023
Wire bond wires for interference shielding
INVENSAS LLC2 citations72
US11398258B2Jul 26, 2022
Multi-die module with low power operation
INVENSAS LLC4 citations72
US11599299B2Mar 7, 2023
3D memory circuit
INVENSAS LLC2 citations71
US12154858B2Nov 26, 2024
Connecting multiple chips using an interconnect device
INVENSAS LLC1 citations62
US12021041B2Jun 25, 2024
Region shielding within a package of a microelectronic device
INVENSAS LLC0 citations62
USRE49987EMay 28, 2024
Multiple plated via arrays of different wire heights on a same substrate
INVENSAS LLC0 citations62
US11735563B2Aug 22, 2023
Package-on-package assembly with wire bond vias
INVENSAS LLC0 citations62
US11804469B2Oct 31, 2023
Active bridging apparatus
INVENSAS LLC0 citations52