Assignee
ISHIDA HISASHI
JP5 patents
Top patents by PatentIndex Score
US8106303B2Jan 31, 2012
Printed wiring board including a thermal land for supressing heat dissipation
ISHIDA HISASHI7 citations83
US9313877B2Apr 12, 2016
Electronic device and noise suppression method
ISHIDA HISASHI3 citations72
US9027991B2May 12, 2015
Racing bucket seat and cooling system for racing car with the same
ISHIDA HISASHI6 citations64
US9320141B2Apr 19, 2016
Wiring structure, cable, and method of manufacturing wiring structure
ISHIDA HISASHI0 citations51
US8921711B2Dec 30, 2014
Wiring substrate and electronic device
ISHIDA HISASHI0 citations51