Assignee
ISHIHARA MASAMICHI
JP9 patents
Top patents by PatentIndex Score
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Method for manufacturing a chip-size double side connection package
ISHIHARA MASAMICHI12 citations84
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Semiconductor chip package with post electrodes
ISHIHARA MASAMICHI7 citations82
US9812621B2Nov 7, 2017
Semiconductor device and fabrication method for same
ISHIHARA MASAMICHI5 citations69
US8415789B2Apr 9, 2013
Three-dimensionally integrated semicondutor device and method for manufacturing the same
ISHIHARA MASAMICHI3 citations63
US8399980B2Mar 19, 2013
Electronic component used for wiring and method for manufacturing the same
ISHIHARA MASAMICHI2 citations61
US8664666B2Mar 4, 2014
Semiconductor device and process for fabricating the same
ISHIHARA MASAMICHI0 citations52
US8952261B2Feb 10, 2015
Interconnect-use electronic component and method for producing same
ISHIHARA MASAMICHI1 citations51
US8501542B2Aug 6, 2013
Double-faced electrode package, and its manufacturing method
ISHIHARA MASAMICHI0 citations51
US8154110B2Apr 10, 2012
Double-faced electrode package and its manufacturing method
ISHIHARA MASAMICHI0 citations51