Assignee
ISHIKAWA HIRAKU
JP·6 granted patents·2 pending applications·10 citations·filing 2008–2012
Top patents by PatentIndex Score
8 records- 0177US8741396B2Method for forming amorphous carbon nitride film, amorphous carbon nitride film, multilayer resist film, method for manufacturing semiconductor device, and storage medium in which control program is storedISHIKAWA HIRAKU·Filed 2009·Granted Jun 3, 2014·5 cites·10 claims
- 0273US8461047B2Method for processing amorphous carbon film, and semiconductor device manufacturing method using the methodISHIKAWA HIRAKU·Filed 2009·Granted Jun 11, 2013·1 cites·8 claims
- 0368US8262844B2Plasma processing apparatus, plasma processing method and storage mediumISHIKAWA HIRAKU·Filed 2008·Granted Sep 11, 2012·3 cites·14 claims
- 0455US8409460B2Forming method of amorphous carbon film, amorphous carbon film, multilayer resist film, manufacturing method of semiconductor device, and computer-readable storage mediumISHIKAWA HIRAKU·Filed 2008·Granted Apr 2, 2013·1 cites·7 claims
- 0550US8936829B2Method of aftertreatment of amorphous hydrocarbon film and method for manufacturing electronic device by using the aftertreatment methodISHIKAWA HIRAKU·Filed 2009·Granted Jan 20, 2015·0 cites·10 claims
- 0643US8809207B2Pattern-forming method and method for manufacturing semiconductor deviceISHIKAWA HIRAKU·Filed 2012·Granted Aug 19, 2014·0 cites·10 claims
- 0739US2013330928A1Film forming device, substrate processing system and semiconductor device manufacturing methodISHIKAWA HIRAKU·Filed 2012·Application pending·0 cites
- 0838US2012160671A1Sputtering deviceISHIKAWA HIRAKU·Filed 2010·Application pending·0 cites
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