Assignee
ISHIKAWA TOSHIKAZU
JP·2 granted patents·20 citations·filing 2008–2012
Top patents by PatentIndex Score
2 records- 0188US8159058B2Semiconductor device having wiring substrate stacked on another wiring substrateISHIKAWA TOSHIKAZU·Filed 2008·Granted Apr 17, 2012·18 cites·8 claims
- 0272US8698299B2Semiconductor device with wiring substrate including lower conductive pads and testing conductive padsISHIKAWA TOSHIKAZU·Filed 2012·Granted Apr 15, 2014·2 cites·6 claims
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