Assignee
ISHIMATSU TOMOYUKI
JP·9 granted patents·23 citations·filing 2009–2012
Top patents by PatentIndex Score
9 records- 0185US8395052B2Conductive particle, anisotropic conductive film, joined structure, and joining methodISHIMATSU TOMOYUKI·Filed 2010·Granted Mar 12, 2013·8 cites·16 claims
- 0281US8932716B2Conductive particle, and anisotropic conductive film, bonded structure, and bonding methodISHIMATSU TOMOYUKI·Filed 2011·Granted Jan 13, 2015·3 cites·13 claims
- 0381US8796557B2Adhesive film, connecting method, and joined structureISHIMATSU TOMOYUKI·Filed 2009·Granted Aug 5, 2014·5 cites·19 claims
- 0465US8309638B2Connecting film, and joined structure and method for producing the sameISHIMATSU TOMOYUKI·Filed 2011·Granted Nov 13, 2012·2 cites·4 claims
- 0564US8273207B2Method for connecting electronic part and joined structureISHIMATSU TOMOYUKI·Filed 2009·Granted Sep 25, 2012·3 cites·6 claims
- 0663US8980043B2Anisotropic conductive film, joined structure and method for producing the joined structureISHIMATSU TOMOYUKI·Filed 2012·Granted Mar 17, 2015·0 cites·4 claims
- 0762US8247697B2Anisotropic conductive film, joined structure and method for producing the joined structureISHIMATSU TOMOYUKI·Filed 2009·Granted Aug 21, 2012·2 cites·9 claims
- 0848US8330052B2Joined structure and method for producing the sameISHIMATSU TOMOYUKI·Filed 2011·Granted Dec 11, 2012·0 cites·6 claims
- 0942US8158887B2Adhesive film, connecting method, and joined structureISHIMATSU TOMOYUKI·Filed 2010·Granted Apr 17, 2012·0 cites·6 claims
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