Assignee
ISHINO MASAKAZU
JP·3 granted patents·1 pending application·18 citations·filing 2007–2012
Top patents by PatentIndex Score
4 records- 0190US8298940B2Semiconductor memory device and manufacturing method thereofISHINO MASAKAZU·Filed 2011·Granted Oct 30, 2012·11 cites·20 claims
- 0285US8513121B2Semiconductor memory device and manufacturing method thereofISHINO MASAKAZU·Filed 2012·Granted Aug 20, 2013·7 cites·20 claims
- 0350US8334465B2Wafer of circuit board and joining structure of wafer or circuit boardISHINO MASAKAZU·Filed 2008·Granted Dec 18, 2012·0 cites·24 claims
- 0444US2008009124A1Method of forming a semiconductor deviceISHINO MASAKAZU·Filed 2007·Application pending·0 cites
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