Assignee
ISHIZAKA TADAHIRO
JP·7 granted patents·2 pending applications·503 citations·filing 2005–2012
Top patents by PatentIndex Score
9 records- 0198US8974868B2Post deposition plasma cleaning system and methodISHIZAKA TADAHIRO·Filed 2005·Granted Mar 10, 2015·466 cites·24 claims
- 0287US8399353B2Methods of forming copper wiring and copper film, and film forming systemISHIZAKA TADAHIRO·Filed 2011·Granted Mar 19, 2013·9 cites·13 claims
- 0386US8242019B2Selective deposition of metal-containing cap layers for semiconductor devicesISHIZAKA TADAHIRO·Filed 2009·Granted Aug 14, 2012·12 cites·9 claims
- 0485US8058728B2Diffusion barrier and adhesion layer for an interconnect structureISHIZAKA TADAHIRO·Filed 2008·Granted Nov 15, 2011·13 cites·13 claims
- 0573US8859422B2Method of forming copper wiring and method and system for forming copper filmISHIZAKA TADAHIRO·Filed 2012·Granted Oct 14, 2014·3 cites·26 claims
- 0651US8716132B2Radiation-assisted selective deposition of metal-containing cap layersISHIZAKA TADAHIRO·Filed 2009·Granted May 6, 2014·0 cites·20 claims
- 0746US8999841B2Semiconductor device manufacturing methodISHIZAKA TADAHIRO·Filed 2012·Granted Apr 7, 2015·0 cites·3 claims
- 0840US2013237053A1Film forming method and film forming apparatusISHIZAKA TADAHIRO·Filed 2011·Application pending·0 cites
- 0939US2013252417A1Thin film forming methodISHIZAKA TADAHIRO·Filed 2012·Application pending·0 cites
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