Assignee
ISHIZUKA TOHRU
JP·3 granted patents·0 citations·filing 2009–2009
Top patents by PatentIndex Score
3 records- 0148US8466538B2SOI wafer, semiconductor device, and method for manufacturing SOI waferISHIZUKA TOHRU·Filed 2009·Granted Jun 18, 2013·0 cites·5 claims
- 0247US8202787B2Method for manufacturing SOI waferISHIZUKA TOHRU·Filed 2009·Granted Jun 19, 2012·0 cites·16 claims
- 0345US8697544B2Method for manufacturing bonded waferISHIZUKA TOHRU·Filed 2009·Granted Apr 15, 2014·0 cites·1 claims
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