Assignee
ITEQ CORP
TW·15 granted patents·15 pending applications·14 citations·filing 2007–2023
Top patents by PatentIndex Score
30 records- 0183US9674992B2Electromagnetic interference shielding filmITEQ CORP·Filed 2015·Granted Jun 6, 2017·7 cites·16 claims
- 0279US9245667B2Circuit boardITEQ CORP·Filed 2013·Granted Jan 26, 2016·2 cites·3 claims
- 0373US7842401B2Halogen-free varnish and prepreg thereofITEQ CORP·Filed 2009·Granted Nov 30, 2010·1 cites·14 claims
- 0468US10518503B2Laminated substrateITEQ CORP·Filed 2018·Granted Dec 31, 2019·2 cites·10 claims
- 0564US12415339B2Resin composition and metal clad substrateITEQ CORP·Filed 2022·Granted Sep 16, 2025·0 cites·10 claims
- 0663US11503708B2Resin composition, prepreg, and printed circuit boardITEQ CORP·Filed 2021·Granted Nov 15, 2022·0 cites·14 claims
- 0763US2023348673A1Toughened resin compositionITEQ CORP·Filed 2022·Application pending·0 cites
- 0863US2022153945A1Polymer matrix composite, prepreg and printed circuit board for eliminating skew and fiber weave effectITEQ CORP·Filed 2022·Application pending·0 cites
- 0962US7612049B2Method of inhibition the growth of algaeITEQ CORP·Filed 2007·Granted Nov 3, 2009·1 cites·2 claims
- 1061US9257212B2Dielectric material with low dielectric lossITEQ CORP·Filed 2013·Granted Feb 9, 2016·0 cites·3 claims
- 1161US2023348708A1Toughened resin compositionITEQ CORP·Filed 2022·Application pending·0 cites
- 1255US12565582B2Resin composition and metal clad substrateITEQ CORP·Filed 2023·Granted Mar 3, 2026·0 cites·10 claims
- 1352US10696783B2Resin composition, prepreg, and copper clad laminateITEQ CORP·Filed 2017·Granted Jun 30, 2020·0 cites·17 claims
- 1452US9771456B2Polyimide resins containing polymaleic anhydride and method for manufacturing the sameITEQ CORP·Filed 2013·Granted Sep 26, 2017·1 cites·3 claims
- 1552US2020413536A1Polymer matrix composite, prepreg and printed circuit board for eliminating skew and fiber weave effectITEQ CORP·Filed 2020·Application pending·0 cites
- 1650US9455067B2Low dielectric materialsITEQ CORP·Filed 2015·Granted Sep 27, 2016·0 cites·12 claims
- 1749US7955701B2Prepreg and resin for preparing the sameITEQ CORP·Filed 2009·Granted Jun 7, 2011·0 cites·16 claims
- 1849US2019104612A1Polymer matrix composite for eliminating skew and fiber weave effectITEQ CORP·Filed 2018·Application pending·0 cites
- 1948US10611910B2Halogen-free epoxy resin composition having low dielectric lossITEQ CORP·Filed 2017·Granted Apr 7, 2020·0 cites·7 claims
- 2047US2019390061A1Multi-layered structure and substrateITEQ CORP·Filed 2018·Application pending·0 cites
- 2146US2009231859A1Brightness Enhancement ComponentITEQ CORP·Filed 2008·Application pending·0 cites
- 2245US2010046103A1Brightness enhancement componentITEQ CORP·Filed 2008·Application pending·0 cites
- 2341US2009280984A1Method of Inhibiting the Growth of AlgaeITEQ CORP·Filed 2008·Application pending·0 cites
- 2441US2015038039A1Organic-inorganic hybrid material film and method for manufacturing the sameITEQ CORP·Filed 2013·Application pending·0 cites
- 2537US7786029B2Resin composition and application thereofITEQ CORP·Filed 2009·Granted Aug 31, 2010·0 cites·14 claims
- 2637US2015148453A1Halogen-free epoxy resin composition for integrated circuit packagingITEQ CORP·Filed 2013·Application pending·0 cites
- 2737US2015147799A1Halogen-free high-frequency resin compositionITEQ CORP·Filed 2013·Application pending·0 cites
- 2837US2015148450A1Halogen-free low-expansion resin compositionITEQ CORP·Filed 2013·Application pending·0 cites
- 2936US2014093722A1Electromagnetic interference shielding structureITEQ CORP·Filed 2013·Application pending·0 cites
- 3035US2021147646A1Prepreg, laminated and printed circuit board thereofITEQ CORP·Filed 2020·Application pending·0 cites
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