Assignee
ITOKAZU ATSUSHI
JP·2 granted patents·3 citations·filing 2011–2012
Technology mixB23H2
Top patents by PatentIndex Score
2 records- 0168US9089916B2Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing methodITOKAZU ATSUSHI·Filed 2011·Granted Jul 28, 2015·3 cites·8 claims
- 0242US9707638B2Wire electric-discharge machining device, wire electric-discharge machining method, thin-plate manufacturing method, and semiconductor wafer manufacturing methodITOKAZU ATSUSHI·Filed 2012·Granted Jul 18, 2017·0 cites·5 claims
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