Assignee
IWAMURA EIJI
JP·2 granted patents·2 pending applications·2 citations·filing 2004–2010
Top patents by PatentIndex Score
4 records- 0171US8323752B2Carbon-based thin film, and process for producing the same, and member using the thin filmIWAMURA EIJI·Filed 2005·Granted Dec 4, 2012·2 cites·9 claims
- 0240US8178471B2Hydrogen storage materials and process for the preparation of the sameIWAMURA EIJI·Filed 2004·Granted May 15, 2012·0 cites·6 claims
- 0331US2012291922A1Solder pasteIWAMURA EIJI·Filed 2010·Application pending·0 cites
- 0430US2012291921A1Flux for solder paste, and solder pasteIWAMURA EIJI·Filed 2010·Application pending·0 cites
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