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IWASE TEPPEI
JP3 patents
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US8426965B2Apr 23, 2013
Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
IWASE TEPPEI2 citations60
US8264079B2Sep 11, 2012
Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
IWASE TEPPEI3 citations60
US8106521B2Jan 31, 2012
Semiconductor device mounted structure with an underfill sealing-bonding resin with voids
IWASE TEPPEI4 citations60