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J-DEVICES CORP
JP11 patents
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US9837382B2Dec 5, 2017
Semiconductor package and manufacturing method thereof
J-DEVICES CORP5 citations71
US9635762B2Apr 25, 2017
Semiconductor package
J-DEVICES CORP6 citations71
US9553052B2Jan 24, 2017
Magnetic shielding package of non-volatile magnetic memory element
J-DEVICES CORP4 citations71
US9786611B2Oct 10, 2017
Method for manufacturing a semiconductor package
J-DEVICES CORP4 citations68
US9721900B2Aug 1, 2017
Semiconductor package and its manufacturing method
J-DEVICES CORP0 citations52
US9595488B2Mar 14, 2017
Semiconductor device
J-DEVICES CORP0 citations52
US9627289B2Apr 18, 2017
Semiconductor device
J-DEVICES CORP0 citations50
US9601450B2Mar 21, 2017
Semiconductor package
J-DEVICES CORP0 citations50
US9418944B2Aug 16, 2016
Semiconductor package
J-DEVICES CORP0 citations47
US9685376B2Jun 20, 2017
Semiconductor device and method of manufacturing semiconductor device
J-DEVICES CORP0 citations39
US9412685B2Aug 9, 2016
Semiconductor device and method of manufacturing the same
J-DEVICES CORP0 citations27