Assignee
JADE CORP
10 granted patents·222 citations·filing 1974–1984
Top patents by PatentIndex Score
10 records- 0185US4010885AApparatus for accurately bonding leads to a semi-conductor die or the likeJADE CORP·Filed 1974·Granted Mar 8, 1977·35 cites·7 claims
- 0282US4166562AAssembly system for microcomponent devices such as semiconductor devicesJADE CORP·Filed 1977·Granted Sep 4, 1979·48 cites·26 claims
- 0375US3949925AOuter lead bonderJADE CORP·Filed 1974·Granted Apr 13, 1976·21 cites·6 claims
- 0471US4273204ACapacitive force load cell for weighing scaleJADE CORP·Filed 1978·Granted Jun 16, 1981·18 cites·14 claims
- 0567US4400714ALead frame for semiconductor chipJADE CORP·Filed 1980·Granted Aug 23, 1983·38 cites·7 claims
- 0661US4300715AMechanical pulse reflow bonding processJADE CORP·Filed 1980·Granted Nov 17, 1981·25 cites·1 claims
- 0746US4572757AMethod of making a microcircuit substrateJADE CORP·Filed 1984·Granted Feb 25, 1986·20 cites·4 claims
- 0835US4378902AApparatus for preventing wire sag in the wire bonding process for producing semiconductor devicesJADE CORP·Filed 1981·Granted Apr 5, 1983·9 cites·1 claims
- 0935US4025750ACompliant electrodeJADE CORP·Filed 1975·Granted May 24, 1977·8 cites·7 claims
- 1028US4015763AAlignment pawl for film-carrier advance mechanismJADE CORP·Filed 1975·Granted Apr 5, 1977·0 cites·8 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →