Assignee
JAKOB ANDREAS
DE3 patents
Top patents by PatentIndex Score
US8911583B2Dec 16, 2014
Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement
JAKOB ANDREAS9 citations82
US9165907B2Oct 20, 2015
Method and a system for producing a semi-conductor module
JAKOB ANDREAS3 citations61
US8173522B2May 8, 2012
Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
JAKOB ANDREAS3 citations59