Assignee

JAMES STEPHEN L

US·3 granted patents·29 citations·filing 2000–2012

Technology mixH10W3

Top patents by PatentIndex Score

3 records

0176US8207599B2Method and apparatus for directing molding compound flow and resulting semiconductor device packagesJAMES STEPHEN L·Filed 2011·Granted Jun 26, 2012·3 cites·20 claims
0276US7054161B1Slotted adhesive for die-attach in BOC and LOC packagesJAMES STEPHEN L·Filed 2000·Granted May 30, 2006·25 cites·66 claims
0365US8399966B2Inserts for directing molding compound flow and semiconductor die assembliesJAMES STEPHEN L·Filed 2012·Granted Mar 19, 2013·1 cites·20 claims

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