Assignee
JANG KI YOUN
KR·4 granted patents·147 citations·filing 2006–2012
Technology mixH10W4
Top patents by PatentIndex Score
4 records- 0198US8304900B2Integrated circuit packaging system with stacked lead and method of manufacture thereofJANG KI YOUN·Filed 2010·Granted Nov 6, 2012·120 cites·20 claims
- 0295US8471394B2Integrated circuit packaging system with package-on-package and method of manufacture thereofJANG KI YOUN·Filed 2011·Granted Jun 25, 2013·22 cites·9 claims
- 0369US8772916B2Integrated circuit package system employing mold flash prevention technologyJANG KI YOUN·Filed 2012·Granted Jul 8, 2014·2 cites·5 claims
- 0467US8252615B2Integrated circuit package system employing mold flash prevention technologyJANG KI YOUN·Filed 2006·Granted Aug 28, 2012·3 cites·10 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →