Assignee
JAPAN ELECTRONIC MAT CORPORATION
JP·9 granted patents·10 pending applications·18 citations·filing 2016–2023
Top patents by PatentIndex Score
19 records- 0195US9972933B2Contact probeJAPAN ELECTRONIC MAT CORPORATION·Filed 2017·Granted May 15, 2018·16 cites·4 claims
- 0291US12392801B2Probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2021·Granted Aug 19, 2025·2 cites·9 claims
- 0366US12596147B2Alignment chip for probe card, probe card and probe card repair methodJAPAN ELECTRONIC MAT CORPORATION·Filed 2021·Granted Apr 7, 2026·0 cites·8 claims
- 0461US9841438B2Guide plate for a probe card and probe card provided with sameJAPAN ELECTRONIC MAT CORPORATION·Filed 2016·Granted Dec 12, 2017·0 cites·16 claims
- 0555US12467953B2Probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2021·Granted Nov 11, 2025·0 cites·9 claims
- 0655US12332278B2Probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2020·Granted Jun 17, 2025·0 cites·3 claims
- 0754US12339314B2Probe card and method for repairing probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2021·Granted Jun 24, 2025·0 cites·4 claims
- 0854US2025264500A1Probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2022·Application pending·0 cites
- 0953US10139430B2Probe guide, probe card, and method for probe guide manufacturingJAPAN ELECTRONIC MAT CORPORATION·Filed 2017·Granted Nov 27, 2018·0 cites·7 claims
- 1053US2025052784A1Probe pin and probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2023·Application pending·0 cites
- 1153US2026050010A1Probe for probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2022·Application pending·0 cites
- 1252US12546803B2Probe-card multilayer wiring substrate and probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2020·Granted Feb 10, 2026·0 cites·11 claims
- 1351US2025180605A1Probe passing method and probeJAPAN ELECTRONIC MAT CORPORATION·Filed 2022·Application pending·0 cites
- 1451US2025085311A1Composite probe, method for attaching probe, and method for manufacturing probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2022·Application pending·0 cites
- 1551US2026098875A1Cantilever-type probe for probe card, and probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2022·Application pending·0 cites
- 1649US2023258689A1Probe of probe card use, and method for manufacturing the sameJAPAN ELECTRONIC MAT CORPORATION·Filed 2022·Application pending·0 cites
- 1749US2025189559A1Probe, probe card, and probe manufacturing methodJAPAN ELECTRONIC MAT CORPORATION·Filed 2022·Application pending·0 cites
- 1848US2025027973A1Probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2021·Application pending·0 cites
- 1941US2026098876A1Probe for probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2022·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →