Assignee
JAPAN ELECTRONIC MATERIALS
JP·11 granted patents·3 pending applications·248 citations·filing 1981–2017
Top patents by PatentIndex Score
14 records- 0196US4523144AComplex probe card for testing a semiconductor waferJAPAN ELECTRONIC MATERIALS·Filed 1981·Granted Jun 11, 1985·118 cites·1 claims
- 0288US4518914ATesting apparatus of semiconductor wafersJAPAN ELECTRONIC MATERIALS·Filed 1982·Granted May 21, 1985·61 cites·5 claims
- 0384US9774121B2Contact probeJAPAN ELECTRONIC MATERIALS·Filed 2013·Granted Sep 26, 2017·5 cites·15 claims
- 0484US6967493B2Probe card and contactor of the sameJAPAN ELECTRONIC MATERIALS·Filed 2004·Granted Nov 22, 2005·35 cites·14 claims
- 0576US7106080B2Probe card and contactor of the sameJAPAN ELECTRONIC MATERIALS·Filed 2005·Granted Sep 12, 2006·6 cites·8 claims
- 0658US10908180B2Probe card case and probe card transfer methodJAPAN ELECTRONIC MATERIALS·Filed 2017·Granted Feb 2, 2021·0 cites·9 claims
- 0758US9535096B2Guide plate for a probe card and probe card provided with sameJAPAN ELECTRONIC MATERIALS·Filed 2013·Granted Jan 3, 2017·1 cites·4 claims
- 0858US7081766B2Probe card for examining semiconductor devices on semiconductor wafersJAPAN ELECTRONIC MATERIALS·Filed 2004·Granted Jul 25, 2006·9 cites·18 claims
- 0954US10184954B2Probe card case and probe card transfer methodJAPAN ELECTRONIC MATERIALS·Filed 2013·Granted Jan 22, 2019·0 cites·6 claims
- 1051US9459287B2Guide plate for probe cardJAPAN ELECTRONIC MATERIALS·Filed 2014·Granted Oct 4, 2016·0 cites·9 claims
- 1148US6013169AMethod of reforming a tip portion of a probeJAPAN ELECTRONIC MATERIALS·Filed 1998·Granted Jan 11, 2000·13 cites·9 claims
- 1242US2009174422A1Probe Card and Manufacturing Method ThereofJAPAN ELECTRONIC MATERIALS·Filed 2006·Application pending·0 cites
- 1341US2013105212A1Multilayer insulating substrate and method for manufacturing the sameJAPAN ELECTRONIC MATERIALS·Filed 2012·Application pending·0 cites
- 1431US2002153913A1Probe for the probe cardJAPAN ELECTRONIC MATERIALS·Filed 2001·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →