Assignee

JEONG CHUL

KR·1 granted patent·12 citations·filing 2010–2010

Technology mixC08G1 C08L1 C09J1 H10W1

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0182US8557896B2Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding filmJEONG CHUL·Filed 2010·Granted Oct 15, 2013·12 cites·19 claims

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