Assignee
JEREZA ARMAND VINCENT C
PH·3 granted patents·25 citations·filing 2008–2012
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0184US8222718B2Semiconductor die package and method for making the sameJEREZA ARMAND VINCENT C·Filed 2009·Granted Jul 17, 2012·12 cites·17 claims
- 0278US8188587B2Semiconductor die package including lead with end portionJEREZA ARMAND VINCENT C·Filed 2008·Granted May 29, 2012·10 cites·10 claims
- 0372US8497164B2Semiconductor die package and method for making the sameJEREZA ARMAND VINCENT C·Filed 2012·Granted Jul 30, 2013·3 cites·17 claims
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