Assignee
JFE PREC CORPORATION
JP·3 granted patents·0 citations·filing 2017–2020
Top patents by PatentIndex Score
3 records- 0146US12130096B2Heat sink, semiconductor package and semiconductor moduleJFE PREC CORPORATION·Filed 2020·Granted Oct 29, 2024·0 cites·11 claims
- 0243US11646243B2Heat sink and method for manufacturing sameJFE PREC CORPORATION·Filed 2018·Granted May 9, 2023·0 cites·19 claims
- 0343US11270926B2Heat sink and method for manufacturing sameJFE PREC CORPORATION·Filed 2017·Granted Mar 8, 2022·0 cites·24 claims
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