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JI BING
US
3 patents
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US8236188B2
Aug 7, 2012
Method for low-K dielectric etch with reduced damage
JI BING
2 citations
59
US8741165B2
Jun 3, 2014
Reducing twisting in ultra-high aspect ratio dielectric etch
JI BING
0 citations
49
US8691701B2
Apr 8, 2014
Strip with reduced low-K dielectric damage
JI BING
1 citations
47