Assignee
JUNGE JOACHIM
DE·1 granted patent·1 pending application·3 citations·filing 2008–2012
Top patents by PatentIndex Score
2 records- 0161US8197300B2Simultaneous double-side grinding of semiconductor wafersJUNGE JOACHIM·Filed 2008·Granted Jun 12, 2012·3 cites·13 claims
- 0236US2013061842A1Single-layered winding of sawing wire with fixedly bonded abrasive grain for wire saws for slicing wafers from a workpieceJUNGE JOACHIM·Filed 2012·Application pending·0 cites
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