Assignee
JUSKEY FRANK J
US·2 granted patents·1 pending application·27 citations·filing 2010–2012
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0189US8487435B2Sheet-molded chip-scale packageJUSKEY FRANK J·Filed 2011·Granted Jul 16, 2013·23 cites·18 claims
- 0272US8680683B1Wafer level package with embedded passive components and method of manufacturingJUSKEY FRANK J·Filed 2010·Granted Mar 25, 2014·4 cites·11 claims
- 0343US2013234344A1Flip-chip packaging techniques and configurationsJUSKEY FRANK J·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →