Assignee
JX METALS CORP
JP·22 granted patents·13 pending applications·8 citations·filing 2018–2023
Top patents by PatentIndex Score
35 records- 0189US11961980B2Lithium ion battery scrap treatment methodJX METALS CORP·Filed 2018·Granted Apr 16, 2024·5 cites·20 claims
- 0287US11851747B2Potassium sodium niobate sputtering target and production method thereofJX METALS CORP·Filed 2019·Granted Dec 26, 2023·2 cites·6 claims
- 0384US12188118B2Potassium sodium niobate sputtering target and production method thereofJX METALS CORP·Filed 2023·Granted Jan 7, 2025·0 cites·2 claims
- 0483US11939663B2Magnetic film and perpendicular magnetic recording mediumJX METALS CORP·Filed 2023·Granted Mar 26, 2024·0 cites·4 claims
- 0582US11981581B2Stannous oxide powderJX METALS CORP·Filed 2018·Granted May 14, 2024·1 cites·7 claims
- 0667US11926924B2Indium phosphide substrate, semiconductor epitaxial wafer, method for producing indium phosphide single-crystal ingot and method for producing indium phosphide substrateJX METALS CORP·Filed 2021·Granted Mar 12, 2024·0 cites·7 claims
- 0767US2025015299A1Rolled Copper Foil for Secondary Battery, and Secondary Battery Negative Electrode and Secondary Battery Using the SameJX METALS CORP·Filed 2022·Application pending·0 cites
- 0866US11967659B2Semiconductor wafer, radiation detection element, radiation detector, and production method for compound semiconductor monocrystalline substrateJX METALS CORP·Filed 2019·Granted Apr 23, 2024·0 cites·5 claims
- 0966US2024344193A1Igzo sputtering targetJX METALS CORP·Filed 2022·Application pending·0 cites
- 1065US12021160B2Semiconductor wafer, radiation detection element, radiation detector, and production method for compound semiconductor monocrystalline substrateJX METALS CORP·Filed 2019·Granted Jun 25, 2024·0 cites·5 claims
- 1165US2025043386A1Method for recovering metals from lithium ion battery wasteJX METALS CORP·Filed 2022·Application pending·0 cites
- 1263US11894221B2Sputtering target and magnetic filmJX METALS CORP·Filed 2019·Granted Feb 6, 2024·0 cites·4 claims
- 1361US12023684B2Sorting machine and method for treating electronic/electric device component scrapsJX METALS CORP·Filed 2020·Granted Jul 2, 2024·0 cites·9 claims
- 1460US11945000B2Method for removing linear objects, device for removing linear objects, and method for processing electronic/electrical equipment component wasteJX METALS CORP·Filed 2021·Granted Apr 2, 2024·0 cites·11 claims
- 1560US2024178384A1Positive electrode active material for all-solid lithium ion batteries, positive electrode for all-solid lithium ion batteries, all-solid lithium ion battery, and method for producing positive electrode active material for all-solid lithium ion batteriesJX METALS CORP·Filed 2021·Application pending·0 cites
- 1659US12000029B2Titanium copper foil, extended copper article, electronic device component, and auto-focus camera moduleJX METALS CORP·Filed 2019·Granted Jun 4, 2024·0 cites·9 claims
- 1758US11970405B2Method for producing lithium carbonateJX METALS CORP·Filed 2019·Granted Apr 30, 2024·0 cites·12 claims
- 1858US11920215B2Easily-crushable copper powder and manufacturing method thereforJX METALS CORP·Filed 2019·Granted Mar 5, 2024·0 cites·8 claims
- 1957US11901170B2Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosphide substrateJX METALS CORP·Filed 2020·Granted Feb 13, 2024·0 cites·8 claims
- 2057US11894225B2Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosphide substrateJX METALS CORP·Filed 2020·Granted Feb 6, 2024·0 cites·13 claims
- 2157US11788203B2Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosphide substrateJX METALS CORP·Filed 2020·Granted Oct 17, 2023·0 cites·7 claims
- 2256US12065759B2Indium phosphide substrateJX METALS CORP·Filed 2022·Granted Aug 20, 2024·0 cites·7 claims
- 2356US2024341071A1Metal-resin composite electromagnetic shielding materialJX METALS CORP·Filed 2022·Application pending·0 cites
- 2455US2024215153A1Copper Foil, Laminate, and Flexible Printed Wiring BoardJX METALS CORP·Filed 2023·Application pending·0 cites
- 2553US12036582B2Method for processing electronic/electrical device component scrapsJX METALS CORP·Filed 2020·Granted Jul 16, 2024·0 cites·9 claims
- 2652US11993464B2Raw material discharge device, method of processing of electronic/electrical device component scrap, and method of raw material discharge for electronic/electrical device component scrapJX METALS CORP·Filed 2020·Granted May 28, 2024·0 cites·14 claims
- 2752US2024141477A1Sputtering target and method for manufacturing sameJX METALS CORP·Filed 2022·Application pending·0 cites
- 2852US2025008613A1MoSi2 HEATERJX METALS CORP·Filed 2022·Application pending·0 cites
- 2951US2025320130A1Copper Oxide-Containing Powder, Conductive Paste, and Method for Producing Copper Oxide-Containing PowderJX METALS CORP·Filed 2022·Application pending·0 cites
- 3050US2024293847A1Method for processing electrical and electronic component scraps and apparatus for processing electronic component scrapsJX METALS CORP·Filed 2021·Application pending·0 cites
- 3150US2024253113A1Copper powderJX METALS CORP·Filed 2022·Application pending·0 cites
- 3249US2024215154A1Copper Foil, Laminate, and Flexible Printed Wiring BoardJX METALS CORP·Filed 2023·Application pending·0 cites
- 3346US2024417846A1Fe-Pt-C-BASED SPUTTERING TARGET MEMBER, SPUTTERING TARGET ASSEMBLY, METHOD FOR FORMING FILM, AND METHOD FOR PRODUCING SPUTTERING TARGET MEMBERJX METALS CORP·Filed 2022·Application pending·0 cites
- 3444US12026867B2Apparatus for analyzing composition of electronic and electrical device part scraps, device for processing electronic and electrical device part scraps, and method for processing electronic and electrical device part scrapsJX METALS CORP·Filed 2019·Granted Jul 2, 2024·0 cites·10 claims
- 3532US11946116B2Method for recovering Cu and method of preparing electrolytic copperJX METALS CORP·Filed 2018·Granted Apr 2, 2024·0 cites·2 claims
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