Assignee
KAGAYA YUTAKA
JP·4 granted patents·76 citations·filing 2008–2012
Top patents by PatentIndex Score
4 records- 0192US8076770B2Semiconductor device including a first land on the wiring substrate and a second land on the sealing portionKAGAYA YUTAKA·Filed 2008·Granted Dec 13, 2011·72 cites·9 claims
- 0278US8247896B2Stacked semiconductor device and fabrication method for sameKAGAYA YUTAKA·Filed 2010·Granted Aug 21, 2012·4 cites·17 claims
- 0351US9252125B2Stacked semiconductor device and fabrication method for sameKAGAYA YUTAKA·Filed 2012·Granted Feb 2, 2016·0 cites·20 claims
- 0444US8710647B2Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring boardKAGAYA YUTAKA·Filed 2011·Granted Apr 29, 2014·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when KAGAYA YUTAKA files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →