Assignee
KAJIYAMA KEIICHI
JP·2 granted patents·1 pending application·18 citations·filing 2005–2011
Top patents by PatentIndex Score
3 records- 0188US8268656B2Optical device wafer processing methodKAJIYAMA KEIICHI·Filed 2010·Granted Sep 18, 2012·13 cites·2 claims
- 0278US8415232B2Dividing method for wafer having die bonding film attached to the back side thereofKAJIYAMA KEIICHI·Filed 2011·Granted Apr 9, 2013·5 cites·3 claims
- 0346US2006094210A1Semiconductor wafer processing method and processing apparatusKAJIYAMA KEIICHI·Filed 2005·Application pending·0 cites
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