Assignee
KAMBIX INNOVATIONS II LLC
US·1 granted patent·2 pending applications·0 citations·filing 2024–2025
Top patents by PatentIndex Score
3 records- 0163US2025336766A1Optimization of the thermal performance of the 3d ics utilizing the integrated chip-size double-layer or multi-layer microchannelsKAMBIX INNOVATIONS II LLC·Filed 2025·Application pending·0 cites
- 0262US12443252B2Heat transfer enhancement for three-dimensional integrated circuit chipsKAMBIX INNOVATIONS II LLC·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 0356US2025157881A1Optimized combined microchannel and heat pipes for electronics coolingKAMBIX INNOVATIONS II LLC·Filed 2024·Application pending·0 cites
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