Assignee
KANAOKA TAKU
JP·3 granted patents·8 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0186US8183691B2Semiconductor device with pads overlapping wiring layers including dummy wiringKANAOKA TAKU·Filed 2010·Granted May 22, 2012·7 cites·9 claims
- 0259US8691597B2Method for manufacturing a semiconductor device including application of a plating voltageKANAOKA TAKU·Filed 2012·Granted Apr 8, 2014·1 cites·8 claims
- 0352US8669659B2Semiconductor device and a method of manufacturing the sameKANAOKA TAKU·Filed 2012·Granted Mar 11, 2014·0 cites·19 claims
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