Assignee
KANEMARU YOSHIKAZU
JP·2 granted patents·1 pending application·10 citations·filing 2008–2012
Top patents by PatentIndex Score
3 records- 0169US8502081B2Assembly substrate and method of manufacturing the sameKANEMARU YOSHIKAZU·Filed 2008·Granted Aug 6, 2013·6 cites·5 claims
- 0265US8237059B2Electronic component-embedded board and method of manufacturing the sameKANEMARU YOSHIKAZU·Filed 2008·Granted Aug 7, 2012·4 cites·5 claims
- 0351US2012285013A1Electronic Component-Embedded Board and Method of Manufacturing the SameKANEMARU YOSHIKAZU·Filed 2012·Application pending·0 cites
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