Assignee
KANG IN SOO
KR·2 granted patents·1 pending application·15 citations·filing 2007–2011
Top patents by PatentIndex Score
3 records- 0175US8093721B2Flip chip semiconductor package and fabrication method thereofKANG IN-SOO·Filed 2007·Granted Jan 10, 2012·9 cites·15 claims
- 0274US8421211B2Wafer level semiconductor package and fabrication method thereofKANG IN SOO·Filed 2010·Granted Apr 16, 2013·6 cites·13 claims
- 0335US2012146216A1Semiconductor package and fabrication method thereofKANG IN SOO·Filed 2011·Application pending·0 cites
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