Assignee
KANG MYUNG-SAM
KR·7 granted patents·4 pending applications·10 citations·filing 2008–2012
Top patents by PatentIndex Score
11 records- 0178US8256112B2Method of manufacturing high density printed circuit boardKANG MYUNG SAM·Filed 2008·Granted Sep 4, 2012·6 cites·6 claims
- 0262US8080741B2Printed circuit boardKANG MYUNG SAM·Filed 2008·Granted Dec 20, 2011·2 cites·10 claims
- 0362US2012192417A1Method of manufacturing a metal clad laminateKANG MYUNG-SAM·Filed 2012·Application pending·0 cites
- 0461US8187479B2Manufacturing method of printed circuit boardKANG MYUNG-SAM·Filed 2008·Granted May 29, 2012·1 cites·5 claims
- 0559US8141241B2Method of manufacturing a printed circuit board having metal bumpsKANG MYUNG SAM·Filed 2009·Granted Mar 27, 2012·1 cites·7 claims
- 0654US8197702B2Manufacturing method of printed circuit boardKANG MYUNG-SAM·Filed 2009·Granted Jun 12, 2012·0 cites·5 claims
- 0753US8464423B2Method of manufacturing a printed circuit board having metal bumpsKANG MYUNG SAM·Filed 2011·Granted Jun 18, 2013·0 cites·4 claims
- 0849US9021690B2Method of manufacturing printed circuit board having buried solder bumpKANG MYUNG SAM·Filed 2011·Granted May 5, 2015·0 cites·8 claims
- 0947US2012073865A1Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the sameKANG MYUNG SAM·Filed 2011·Application pending·0 cites
- 1043US2010193232A1Printed circuit board and method of manufacturing the sameKANG MYUNG SAM·Filed 2009·Application pending·0 cites
- 1142US2010314755A1Printed circuit board, semiconductor device comprising the same, and method of manufacturing the sameKANG MYUNG SAM·Filed 2009·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →