Assignee
KANG SUNG KWON
US·2 granted patents·0 citations·filing 2007–2008
Top patents by PatentIndex Score
2 records- 0150US8679964B2Prevention and control of intermetallic alloy inclusionsKANG SUNG KWON·Filed 2008·Granted Mar 25, 2014·0 cites·7 claims
- 0247US8691685B2Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is presentKANG SUNG KWON·Filed 2007·Granted Apr 8, 2014·0 cites·1 claims
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