Assignee
KANG TECK-GYU
US·5 granted patents·61 citations·filing 2006–2011
Top patents by PatentIndex Score
5 records- 0193US8125066B1Package on package configurations with embedded solder balls and interposal layerKANG TECK-GYU·Filed 2009·Granted Feb 28, 2012·31 cites·17 claims
- 0292US9137903B2Semiconductor chip assembly and method for making sameKANG TECK-GYU·Filed 2011·Granted Sep 15, 2015·13 cites·20 claims
- 0389US8415809B2Flip chip overmold packageKANG TECK-GYU·Filed 2008·Granted Apr 9, 2013·16 cites·17 claims
- 0461US8710643B2Electronic package with fluid flow barriersKANG TECK-GYU·Filed 2011·Granted Apr 29, 2014·1 cites·16 claims
- 0549US8133808B2Wafer level chip package and a method of fabricating thereofKANG TECK-GYU·Filed 2006·Granted Mar 13, 2012·0 cites·19 claims
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