Assignee
KASAI MASAKI
JP3 patents
Top patents by PatentIndex Score
US8446008B2May 21, 2013
Semiconductor device bonding with stress relief connection pads
KASAI MASAKI5 citations71
US8164201B2Apr 24, 2012
Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus
KASAI MASAKI3 citations60
US8664779B2Mar 4, 2014
Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus
KASAI MASAKI0 citations50