Assignee

KASHIWAGI TAKAFUMI

JP·1 granted patent·1 pending application·1 citations·filing 2010–2013

Technology mixH05K2 Y10T2 B22F1 B23K1 C22C1 H01L1

Top patents by PatentIndex Score

2 records

0147US8946563B2Module with exposed parts of copper foil and process for production thereofKASHIWAGI TAKAFUMI·Filed 2010·Granted Feb 3, 2015·1 cites·11 claims
0233US2014110153A1Wiring board and method for manufacturing the sameKASHIWAGI TAKAFUMI·Filed 2013·Application pending·0 cites

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