Assignee
KATAGIRI MITSUAKI
JP·2 granted patents·2 pending applications·0 citations·filing 2006–2012
Top patents by PatentIndex Score
4 records- 0146US8237251B2Semiconductor device including semiconductor chips with different thicknessKATAGIRI MITSUAKI·Filed 2009·Granted Aug 7, 2012·0 cites·20 claims
- 0244US8633596B2Semiconductor package with bonding wires of reduced loop inductanceKATAGIRI MITSUAKI·Filed 2011·Granted Jan 21, 2014·0 cites·12 claims
- 0337US2006249829A1Stacked type semiconductor deviceKATAGIRI MITSUAKI·Filed 2006·Application pending·0 cites
- 0430US2012200159A1Semiconductor deviceKATAGIRI MITSUAKI·Filed 2012·Application pending·0 cites
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