Assignee
KATOGI SHIGEKI
JP·4 granted patents·4 citations·filing 2005–2012
Top patents by PatentIndex Score
4 records- 0161US8138268B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2005·Granted Mar 20, 2012·2 cites·13 claims
- 0259US8518303B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2006·Granted Aug 27, 2013·2 cites·15 claims
- 0351US8309658B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2011·Granted Nov 13, 2012·0 cites·10 claims
- 0448US8696942B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2012·Granted Apr 15, 2014·0 cites·13 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →