Assignee
KATOH TAKEO
JP·1 granted patent·2 pending applications·4 citations·filing 2008–2009
Top patents by PatentIndex Score
3 records- 0166US8147295B2Method of polishing silicon waferKATOH TAKEO·Filed 2009·Granted Apr 3, 2012·4 cites·8 claims
- 0241US2009181546A1Single-Wafer Etching Method for Wafer and Etching Apparatus ThereofKATOH TAKEO·Filed 2008·Application pending·0 cites
- 0340US2008214094A1Method for manufacturing silicon waferKATOH TAKEO·Filed 2008·Application pending·0 cites
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