Assignee
KAWABATA KIICHI
JP·2 granted patents·5 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0180US8987358B2Compound including organopolysiloxane or silsesquioxane skeleton having isocyanuric skeleton, epoxy group and SiH group, thermosetting resin composition containing the compound as adhesion-imparting agent, hardened material and sealing agent for optical semiconductorKAWABATA KIICHI·Filed 2012·Granted Mar 24, 2015·5 cites·10 claims
- 0235US8946357B2Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductorKAWABATA KIICHI·Filed 2011·Granted Feb 3, 2015·0 cites·9 claims
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