Assignee
KAWAMORI TAKASHI
JP5 patents
Top patents by PatentIndex Score
US8445177B2May 21, 2013
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI2 citations61
US8323873B2Dec 4, 2012
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI2 citations61
US8293453B2Oct 23, 2012
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI2 citations61
US8673539B2Mar 18, 2014
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI0 citations51
US8278024B2Oct 2, 2012
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI0 citations51